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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package

By: Material type: TextTextLanguage: English Publication details: Wiley-IEEE Press 2022Edition: 1Description: fulltextISBN:
  • 9781119793779
  • 9781119793847
Subject(s): Online resources:
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Item type Current library Call number Status Date due Barcode
IEEE-Wiley eBooks Library IEEE-Wiley eBooks Library School of Engineering Available 9648539

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