ONLINE PUBLIC ACCESS CATALOG(OPAC)

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (Record no. 12173)

MARC details
000 -LEADER
fixed length control field 00657nam a2200205Ia 4500
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 230120s2022 xx 000 0 und d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781119793779
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781119793847
041 ## - LANGUAGE CODE
Language code of text/sound track or separate title eng
110 ## - MAIN ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element Keser
245 ## - TITLE STATEMENT
Title Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package
250 ## - EDITION STATEMENT
Edition statement 1
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Name of publisher, distributor, etc. Wiley-IEEE Press
Date of publication, distribution, etc. 2022
300 ## - PHYSICAL DESCRIPTION
Other physical details fulltext
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Circuits
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Computing and Processing
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Devices and Systems
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Components
856 ## - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="https://ieeexplore.ieee.org/servlet/opac?bknumber=9648539">https://ieeexplore.ieee.org/servlet/opac?bknumber=9648539</a>
Holdings
Withdrawn status Lost status Damaged status Not for loan Home library Current library Date acquired Total Checkouts Barcode Date last seen Price effective from Koha item type
        School of Engineering School of Engineering 14/12/2021   9648539 08/02/2023 08/02/2023 IEEE-Wiley eBooks Library

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