| 000 | 00736nam a2200241Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2021 xx 000 0 und d | ||
| 022 | _a978-1-6654-4839-0 | ||
| 022 | _a978-4-9911-9111-4 | ||
| 041 | _aeng | ||
| 245 | _a2021 International Conference on Electronics Packaging (ICEP) | ||
| 260 |
_bIEEE _c2021 |
||
| 500 | _aProceeding | ||
| 650 | _aCircuits | ||
| 650 | _aCommunication | ||
| 650 | _aComponents | ||
| 650 | _aDevices and Systems | ||
| 650 | _aEnergy and Industry Applications | ||
| 650 | _aNetworking and Broadcast Technologies | ||
| 650 | _aPhotonics and Electrooptics | ||
| 650 | _aPower | ||
| 650 | _aSignal Processing and Analysis | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=9451900 | ||
| 999 |
_c40518 _d40518 |
||