| 000 | 00773nam a2200241Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2021 xx 000 0 und d | ||
| 022 | _a978-1-6654-2110-2 | ||
| 022 | _a978-1-6654-9447-2 | ||
| 041 | _aeng | ||
| 245 | _a2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) | ||
| 260 |
_bIEEE _c2021 |
||
| 500 | _aProceeding | ||
| 650 | _aCircuits | ||
| 650 | _aComponents | ||
| 650 | _aDevices and Systems | ||
| 650 | _aEnergy and Industry Applications | ||
| 650 | _aEngineering Profession | ||
| 650 | _aGeneral Topics for Engineers | ||
| 650 | _aPower | ||
| 650 | _aRobotics and Control Systems | ||
| 650 | _aSignal Processing and Analysis | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=9663569 | ||
| 999 |
_c39724 _d39724 |
||