| 000 | 00770nam a2200253Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2021 xx 000 0 und d | ||
| 022 | _a978-1-6654-1619-1 | ||
| 022 | _a978-1-6654-1620-7 | ||
| 041 | _aeng | ||
| 245 | _a2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) | ||
| 260 |
_bIEEE _c2021 |
||
| 500 | _aProceeding | ||
| 650 | _aCircuits | ||
| 650 | _aCommunication | ||
| 650 | _aComponents | ||
| 650 | _aDevices and Systems | ||
| 650 | _aDielectrics and Plasmas | ||
| 650 | _aEnergy and Industry Applications | ||
| 650 | _aEngineered Materials | ||
| 650 | _aNetworking and Broadcast Technologies | ||
| 650 | _aPhotonics and Electrooptics | ||
| 650 | _aPower | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=9663571 | ||
| 999 |
_c39708 _d39708 |
||