| 000 | 00715nam a2200241Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2019 xx 000 0 und d | ||
| 022 | _a978-1-7281-4583-9 | ||
| 022 | _a978-1-944543-12-9 | ||
| 041 | _aeng | ||
| 245 | _a2019 International Wafer Level Packaging Conference (IWLPC) | ||
| 260 |
_bIEEE _c2019 |
||
| 500 | _aProceeding | ||
| 650 | _aCircuits | ||
| 650 | _aComponents | ||
| 650 | _aDevices and Systems | ||
| 650 | _aDielectrics and Plasmas | ||
| 650 | _aEngineered Materials | ||
| 650 | _aEngineering Profession | ||
| 650 | _aFields | ||
| 650 | _aGeneral Topics for Engineers | ||
| 650 | _aWaves and Electromagnetics | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=8902179 | ||
| 999 |
_c37159 _d37159 |
||