| 000 | 00636nam a2200205Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2019 xx 000 0 und d | ||
| 022 | _a978-1-7281-0387-7 | ||
| 022 | _a978-4-9047-4307-2 | ||
| 041 | _aeng | ||
| 245 | _a2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) | ||
| 260 |
_bIEEE _c2019 |
||
| 500 | _aProceeding | ||
| 650 | _aCircuits | ||
| 650 | _aComponents | ||
| 650 | _aDevices and Systems | ||
| 650 | _aDielectrics and Plasmas | ||
| 650 | _aEngineered Materials | ||
| 650 | _aPhotonics and Electrooptics | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=8732272 | ||
| 999 |
_c35896 _d35896 |
||