| 000 | 00890nam a2200265Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2018 xx 000 0 und d | ||
| 022 | _a978-1-5090-3955-5 | ||
| 022 | _a978-1-5090-5997-3 | ||
| 041 | _aeng | ||
| 245 | _a2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) | ||
| 260 |
_bIEEE _c2018 |
||
| 500 | _aProceeding | ||
| 650 | _aCircuits | ||
| 650 | _aCommunication | ||
| 650 | _aComponents | ||
| 650 | _aComputing and Processing | ||
| 650 | _aDevices and Systems | ||
| 650 | _aDielectrics and Plasmas | ||
| 650 | _aEngineered Materials | ||
| 650 | _aFields | ||
| 650 | _aGeneral Topics for Engineers | ||
| 650 | _aNetworking and Broadcast Technologies | ||
| 650 | _aWaves and Electromagnetics | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=8387226 | ||
| 999 |
_c34719 _d34719 |
||