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008 | 230209s9999 xx 000 0 und d | ||
041 | _aeng | ||
245 | _aWafer Level Packaging Conference (IWLPC), International | ||
260 | _bIEEE | ||
500 | _aConference | ||
650 | _aCircuits | ||
650 | _aComponents | ||
650 | _aDevices and Systems | ||
650 | _aDielectrics and Plasmas | ||
650 | _aEngineered Materials | ||
650 | _aEngineering Profession | ||
856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=1828904 | ||
999 |
_c31840 _d31840 |