000 00526nam a2200181Ia 4500
008 230209s9999 xx 000 0 und d
041 _aeng
245 _aWafer Level Packaging Conference (IWLPC), International
260 _bIEEE
500 _aConference
650 _aCircuits
650 _aComponents
650 _aDevices and Systems
650 _aDielectrics and Plasmas
650 _aEngineered Materials
650 _aEngineering Profession
856 _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=1828904
999 _c31840
_d31840