| 000 | 00691nam a2200229Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s9999 xx 000 0 und d | ||
| 041 | _aeng | ||
| 245 | _aCongress Molded Interconnect Devices (MID), International | ||
| 260 | _bIEEE | ||
| 500 | _aConference | ||
| 650 | _aAerospace | ||
| 650 | _aCircuits | ||
| 650 | _aCommunication | ||
| 650 | _aComponents | ||
| 650 | _aDevices and Systems | ||
| 650 | _aDielectrics and Plasmas | ||
| 650 | _aEngineered Materials | ||
| 650 | _aGeneral Topics for Engineers | ||
| 650 | _aNetworking and Broadcast Technologies | ||
| 650 | _aSignal Processing and Analysis | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=1816084 | ||
| 999 |
_c29110 _d29110 |
||