| 000 | 00509nam a2200169Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2019 xx 000 0 und d | ||
| 022 | _a978-1-7281-3257-0 | ||
| 022 | _a978-1-7281-3286-0 | ||
| 041 | _aeng | ||
| 245 | _a2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) | ||
| 260 |
_bIEEE _c2019 |
||
| 500 | _aProceeding | ||
| 650 | _aCircuits | ||
| 650 | _aComponents | ||
| 650 | _aDevices and Systems | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=8746988 | ||
| 999 |
_c23235 _d23235 |
||