| 000 | 00576nam a2200193Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2019 xx 000 0 und d | ||
| 022 | _a978-1-7281-4870-0 | ||
| 022 | _a978-1-7281-4871-7 | ||
| 041 | _aeng | ||
| 245 | _a2019 International 3D Systems Integration Conference (3DIC) | ||
| 260 |
_bIEEE _c2019 |
||
| 500 | _aProceeding | ||
| 650 | _aCircuits | ||
| 650 | _aComponents | ||
| 650 | _aComputing and Processing | ||
| 650 | _aDevices and Systems | ||
| 650 | _aSignal Processing and Analysis | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=9043388 | ||
| 999 |
_c22822 _d22822 |
||