| 000 | 00704nam a2200241Ia 4500 | ||
|---|---|---|---|
| 008 | 230209s2019 xx 000 0 und d | ||
| 022 | _a978-1-5386-7610-3 | ||
| 022 | _a978-1-5386-7611-0 | ||
| 041 | _aeng | ||
| 245 | _a2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) | ||
| 260 |
_bIEEE _c2019 |
||
| 500 | _aProceeding | ||
| 650 | _aAerospace | ||
| 650 | _aCircuits | ||
| 650 | _aComponents | ||
| 650 | _aDevices and Systems | ||
| 650 | _aDielectrics and Plasmas | ||
| 650 | _aEnergy and Industry Applications | ||
| 650 | _aEngineered Materials | ||
| 650 | _aPower | ||
| 650 | _aTransportation | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?punumber=8786827 | ||
| 999 |
_c22597 _d22597 |
||