| 000 | 00657nam a2200205Ia 4500 | ||
|---|---|---|---|
| 008 | 230120s2022 xx 000 0 und d | ||
| 020 | _a9781119793779 | ||
| 020 | _a9781119793847 | ||
| 041 | _aeng | ||
| 110 | _aKeser | ||
| 245 | _aEmbedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package | ||
| 250 | _a1 | ||
| 260 |
_bWiley-IEEE Press _c2022 |
||
| 300 | _bfulltext | ||
| 650 | _aCircuits | ||
| 650 | _aComputing and Processing | ||
| 650 | _aDevices and Systems | ||
| 650 | _aComponents | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=9648539 | ||
| 999 |
_c12173 _d12173 |
||