| 000 | 00605nam a2200193Ia 4500 | ||
|---|---|---|---|
| 008 | 230120s2012 xx 000 0 und d | ||
| 020 | _a9780470623466 | ||
| 020 | _a9781118166758 | ||
| 041 | _aeng | ||
| 100 | _aLi | ||
| 245 | _aElectrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC | ||
| 250 | _a1 | ||
| 260 |
_bWiley-IEEE Press _c2012 |
||
| 300 | _bfulltext | ||
| 650 | _aCircuits | ||
| 650 | _aDevices and Systems | ||
| 650 | _aComponents | ||
| 856 | _uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=6183551 | ||
| 999 |
_c12133 _d12133 |
||