TY  - BOOK
TI  - Wafer Level Packaging Conference (IWLPC), International
PB  - IEEE
KW  - Circuits
KW  - Components
KW  - Devices and Systems
KW  - Dielectrics and Plasmas
KW  - Engineered Materials
KW  - Engineering Profession
N1  - Conference
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=1828904
ER  -