TY  - BOOK
TI  - Sustainability and Resilience Conference: Technology and Innovation in Building Designs, International
PB  - IEEE
KW  - Circuits
KW  - Communication
KW  - Components
KW  - Computing and Processing
KW  - Devices and Systems
KW  - Dielectrics and Plasmas
KW  - Energy and Industry Applications
KW  - Engineered Materials
KW  - General Topics for Engineers
KW  - Networking and Broadcast Technologies
KW  - Power
KW  - Transportation
N1  - Conference
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=1839905
ER  -