TY  - BOOK
TI  - Electronics Packaging (ICEP), International Conference on
PB  - IEEE
KW  - Circuits
KW  - Communication
KW  - Components
KW  - Devices and Systems
KW  - Energy and Industry Applications
KW  - Networking and Broadcast Technologies
KW  - Photonics and Electrooptics
KW  - Power
KW  - Signal Processing and Analysis
N1  - Conference
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=1803736
ER  -