TY  - BOOK
TI  - Biometrics Special Interest Group (BIOSIG), Proceedings of the International Conference of the
SN  - 1617-5468
PB  - IEEE
KW  - Computing and Processing
KW  - Engineering Profession
KW  - Photonics and Electrooptics
N1  - Conference
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=1802665
ER  -