TY  - BOOK
TI  - Advanced Packaging and Systems Symposium, EDAPS. Electrical Design of
SN  - 2151-1233
PB  - IEEE
KW  - Circuits
KW  - Communication
KW  - Components
KW  - Computing and Processing
KW  - Devices and Systems
KW  - Fields
KW  - Networking and Broadcast Technologies
KW  - Waves and Electromagnetics
N1  - Conference
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=1002555
ER  -