2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - IEEE 2022

Proceeding

978-1-6654-9177-8 978-91-89711-39-6


Circuits
Components
Devices and Systems
Dielectrics and Plasmas
Engineered Materials
Engineering Profession
Fields
Photonics and Electrooptics
Waves and Electromagnetics