2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - IEEE 2022 Proceeding ISSN: 978-1-6654-9177-8 978-91-89711-39-6 Subjects--Topical Terms: CircuitsComponentsDevices and SystemsDielectrics and PlasmasEngineered MaterialsEngineering ProfessionFieldsPhotonics and ElectroopticsWaves and Electromagnetics