TY  - BOOK
TI  - 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
SN  - 978-1-665
PY  - 2022///
PB  - IEEE
KW  - Aerospace
KW  - Circuits
KW  - Communication
KW  - Components
KW  - Computing and Processing
KW  - Devices and Systems
KW  - Dielectrics and Plasmas
KW  - Energy and Industry Applications
KW  - Engineered Materials
KW  - Networking and Broadcast Technologies
KW  - Photonics and Electrooptics
KW  - Power
KW  - Robotics and Control Systems
KW  - Transportation
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=9899435
ER  -