TY  - BOOK
TI  - 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
SN  - 978-1-728
PY  - 2019///
PB  - IEEE
KW  - Circuits
KW  - Components
KW  - Devices and Systems
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8746988
ER  -