2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) 

 -  IEEE  2019 
<br/><br/> Proceeding 
<br/><br/><label>ISSN: </label>978-1-7281-3257-0 978-1-7281-3286-0 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Circuits<br/>Components<br/>Devices and Systems