2019 International Wafer Level Packaging Conference (IWLPC) 

 -  IEEE  2019 
<br/><br/> Proceeding 
<br/><br/><label>ISSN: </label>978-1-7281-4583-9 978-1-944543-12-9 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Circuits<br/>Components<br/>Devices and Systems<br/>Dielectrics and Plasmas<br/>Engineered Materials<br/>Engineering Profession<br/>Fields<br/>General Topics for Engineers<br/>Waves and Electromagnetics