TY  - BOOK
TI  - 2019 International 3D Systems Integration Conference (3DIC)
SN  - 978-1-728
PY  - 2019///
PB  - IEEE
KW  - Circuits
KW  - Components
KW  - Computing and Processing
KW  - Devices and Systems
KW  - Signal Processing and Analysis
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=9043388
ER  -