2019 International 3D Systems Integration Conference (3DIC) 

 -  IEEE  2019 
<br/><br/> Proceeding 
<br/><br/><label>ISSN: </label>978-1-7281-4870-0 978-1-7281-4871-7 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Circuits<br/>Components<br/>Computing and Processing<br/>Devices and Systems<br/>Signal Processing and Analysis