TY  - BOOK
TI  - 2019 IEEE/ACM 5th International Workshop on Software Engineering for Smart Cyber-Physical Systems (SEsCPS)
SN  - 978-1-728
PY  - 2019///
PB  - IEEE
KW  - Computing and Processing
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8812309
ER  -