TY  - BOOK
TI  - 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
SN  - 978-1-538
PY  - 2019///
PB  - IEEE
KW  - Circuits
KW  - Components
KW  - Devices and Systems
KW  - Dielectrics and Plasmas
KW  - Engineered Materials
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8718745
ER  -