2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 

 -  IEEE  2019 
<br/><br/> Proceeding 
<br/><br/><label>ISSN: </label>978-1-5386-8040-7 978-1-5386-8041-4 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Circuits<br/>Components<br/>Devices and Systems<br/>Dielectrics and Plasmas<br/>Engineered Materials