TY  - BOOK
TI  - 2019 20th International Conference on Electronic Packaging Technology(ICEPT)
SN  - 978-1-728
PY  - 2019///
PB  - IEEE
KW  - Circuits
KW  - Components
KW  - Devices and Systems
KW  - Fields
KW  - Photonics and Electrooptics
KW  - Signal Processing and Analysis
KW  - Waves and Electromagnetics
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=9075848
ER  -