2018 International Wafer Level Packaging Conference (IWLPC) 

 -  IEEE  2018 
<br/><br/> Proceeding 
<br/><br/><label>ISSN: </label>978-1-5386-9308-7 978-1-9445-4306-8 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Circuits<br/>Components<br/>Devices and Systems<br/>Dielectrics and Plasmas<br/>Engineered Materials<br/>Engineering Profession