TY  - BOOK
TI  - 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
SN  - 978-1-538
PY  - 2018///
PB  - IEEE
KW  - Circuits
KW  - Components
KW  - Devices and Systems
KW  - Dielectrics and Plasmas
KW  - Engineered Materials
KW  - Engineering Profession
KW  - Fields
KW  - Photonics and Electrooptics
KW  - Waves and Electromagnetics
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8411684
ER  -