2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) 

 -  IEEE  2018 
<br/><br/> Proceeding 
<br/><br/><label>ISSN: </label>978-1-5386-8019-3 978-952-68150-5-3 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Circuits<br/>Components<br/>Devices and Systems<br/>Dielectrics and Plasmas<br/>Engineered Materials<br/>Engineering Profession<br/>Fields<br/>Photonics and Electrooptics<br/>Waves and Electromagnetics