TY  - BOOK
TI  - 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)
SN  - 978-1-509
PY  - 2018///
PB  - IEEE
KW  - Circuits
KW  - Communication
KW  - Components
KW  - Computing and Processing
KW  - Devices and Systems
KW  - Dielectrics and Plasmas
KW  - Engineered Materials
KW  - Fields
KW  - General Topics for Engineers
KW  - Networking and Broadcast Technologies
KW  - Waves and Electromagnetics
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8387226
ER  -