TY  - BOOK
TI  - 2018 13th International Congress Molded Interconnect Devices (MID)
SN  - 978-1-538
PY  - 2018///
PB  - IEEE
KW  - Aerospace
KW  - Circuits
KW  - Communication
KW  - Components
KW  - Devices and Systems
KW  - Dielectrics and Plasmas
KW  - Engineered Materials
KW  - General Topics for Engineers
KW  - Networking and Broadcast Technologies
KW  - Signal Processing and Analysis
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8511013
ER  -