2018 13th International Congress Molded Interconnect Devices (MID) 

 -  IEEE  2018 
<br/><br/> Proceeding 
<br/><br/><label>ISSN: </label>978-1-5386-4933-6 978-1-5386-4934-3 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Aerospace<br/>Circuits<br/>Communication<br/>Components<br/>Devices and Systems<br/>Dielectrics and Plasmas<br/>Engineered Materials<br/>General Topics for Engineers<br/>Networking and Broadcast Technologies<br/>Signal Processing and Analysis