TY  - BOOK
TI  - 2019 International Wafer Level Packaging Conference (IWLPC)
SN  - 978-1-728
PY  - 2019///
PB  - IEEE
KW  - Circuits
KW  - Components
KW  - Devices and Systems
KW  - Dielectrics and Plasmas
KW  - Engineered Materials
KW  - Engineering Profession
KW  - Fields
KW  - General Topics for Engineers
KW  - Waves and Electromagnetics
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8902179
ER  -