TY  - BOOK
TI  - 2019 IFIP/IEEE 27th International Conference on Very Large Scale Integration (VLSI-SoC)
SN  - 978-1-728
PY  - 2019///
PB  - IEEE
KW  - Circuits
KW  - Components
KW  - Devices and Systems
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8910139
ER  -