TY  - BOOK
TI  - 2019 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)
SN  - 978-1-728
PY  - 2019///
PB  - IEEE
KW  - Computing and Processing
N1  - Proceeding
UR  - https://ieeexplore.ieee.org/servlet/opac?punumber=8713395
ER  -