TY  - BOOK
ED  - Keser
TI  - Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package
SN  - 9781119793779
PY  - 2022///
PB  - Wiley-IEEE Press
KW  - Circuits
KW  - Computing and Processing
KW  - Devices and Systems
KW  - Components
UR  - https://ieeexplore.ieee.org/servlet/opac?bknumber=9648539
ER  -