2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- IEEE 2019
Proceeding
978-1-5386-8040-7 978-1-5386-8041-4
Circuits
Components
Devices and Systems
Dielectrics and Plasmas
Engineered Materials
Proceeding
978-1-5386-8040-7 978-1-5386-8041-4
Circuits
Components
Devices and Systems
Dielectrics and Plasmas
Engineered Materials