Normal view MARC view ISBD view

Wafer Level Packaging Conference (IWLPC), International

Wafer Level Packaging Conference (IWLPC), International - IEEE

Conference

Subjects--Topical Terms:
Circuits
Components
Devices and Systems
Dielectrics and Plasmas
Engineered Materials
Engineering Profession

Place hold
Print
Add to your cart (remove)
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)

ONLINE PUBLIC ACCESS CATALOG(OPAC)

Wafer Level Packaging Conference (IWLPC), International